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IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung High Power Infrared Emitter (850 nm) Lead (Pb) Free Product - RoHS Compliant SFH 4350
Vorlaufige Daten / Preliminary Data
Wesentliche Merkmale * * * * Infrarot LED mit hoher Ausgangsleistung Abstrahlwinkel 13 Sehr hohe Strahlstarke Emissionswellenlange typ. 850 nm Features * * * * High Power Infrared LED Emission angle 13 Very high radiant intensity Peak wavelength typ. 850 nm
Anwendungen * Infrarotbeleuchtung fur CMOS Kameras * Sensorik * Datenubertragung Sicherheitshinweise Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefahrlich fur das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, mussen gema den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 behandelt werden.
Applications * Infrared Illumination for CMOS cameras * Sensor technology * Data transmission Safety Advices Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471.
Typ Type SFH 4350
1)
Bestellnummer Ordering Code Q65110A2091
Strahlstarkegruppierung1) (IF = 100 mA, tp = 20 ms) Radiant Intensity Grouping1) Ie (mW/sr) 40 (typ. 70)
gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr
ATTENTION - Observe Precautions For Handling - Electrostatic Sensitive Device
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SFH 4350
Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Vorwartsgleichstrom Forward current Stostrom, tp = 10 s, D = 0 Surge current Verlustleistung Power dissipation Symbol Symbol Wert Value - 40 ... + 100 5 100 1.5 180 450 Einheit Unit C V mA A mW K/W
Top , Tstg VR IF IFSM Ptot
Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA Abstrahlwinkel Half angle Aktive Chipflache Active chip area Abmessungen der aktiven Chipflache Dimension of the active chip area Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Symbol Symbol peak
Wert Value 850
Einheit Unit nm
35
nm
13 0.09 0.3 x 0.3 12
Grad deg. mm2 mm ns
A LxB LxW tr , tf
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SFH 4350
Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s Sperrstrom Reverse current VR = 5 V Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms Symbol Symbol Wert Value Einheit Unit
VF VF IR
1.5 (< 1.8) 2.4 (< 3.0)
V V
not designed for A reverse operation 50 mW
e typ
Temperaturkoeffizient von Ie bzw. e, TCI IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA
- 0.5
%/K
TCV TC
- 0.7 + 0.2
mV/K nm/K
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SFH 4350
Strahlstarke Ie in Achsrichtung1) gemessen bei einem Raumwinkel = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Symbol SFH 4350 -U Strahlstarke Ie min Radiant intensity Ie max IF = 100 mA, tp = 20 ms Strahlstarke Radiant intensity IF = 1 A, tp = 100 s
1)
Werte Values SFH 4350 -V 63 125 700 SFH 4350 -AW 100 200 900 SFH 4350 -BW 160 320 1100
Einheit Unit
40 80 500
mW/sr mW/sr mW/sr
Ie typ
Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one group in one packing unit (variation lower 2:1)
Abstrahlcharakteristik Radiation Characteristics Irel = f ()
40 30 20 10 0 1.0
OHF02499
50
0.8 60
0.6
70
0.4
80 90
0.2 0
100
1.0
0.8
0.6
0.4
0
20
40
60
80
100
120
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SFH 4350
Relative Spectral Emission Irel = f ()
100 %
OHL01714
Radiant Intensity
Ie = f (IF) Ie 100 mA
OHL01715
Single pulse, tp = 20 s
101
Max. Permissible Forward Current IF = f (TA), RthJA = 450 K/W
125
OHR00880
Ie I e (100 mA)
10 5
0
F mA
100
I rel 80
60
75
10-1
40
5
50
10-2
20
5
25
0 700
750
800
850
nm 950
10-3 0 10
5 10 1
5 10 2
mA 10 3
0
0
20
40
60
IF
80 C 100 T
Forward Current IF = f (VF) Single pulse, tp = 20 s
Permissible Pulse Handling Capability IF = f (), TA = 25 C, duty cycle D = parameter
OHL01713
IF
10 A
0
1.6 IF A 1.4 1.2 1.0 0.8 0.6
OHF02505
D = TP
t
tP
IF T
10 -1 5
D=
0.005 0.01 0.02 0.033 0.05 0.1 0.2 0.5 1
10 -2 5
10
-3
5
0.4 0.2
0 0.5 1 1.5 2 2.5 V 3
10 -4
VF
0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102
tp
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SFH 4350
Mazeichnung Package Outlines
0.6 (0.024) 0.4 (0.016) 0.7 (0.028) 0.4 (0.016)
Surface not flat 2
3.1 (0.122) 2.9 (0.114)
5.2 (0.205) 4.5 (0.177) 4.1 (0.161) 3.9 (0.154)
2.54 (0.100) spacing
0.6 (0.024) 0.4 (0.016)
0.8 (0.031)
0.4 (0.016)
1 Chip position 3.3 (0.130) 6.3 (0.248) 5.9 (0.232)
4.0 (0.157) 3.6 (0.142)
1.8 (0.071) 1.2 (0.047)
GEMY6689
Mae in mm (inch) / Dimensions in mm (inch).
Gehause / Package Anschlussbelegung Pin configuration
3 mm, klares Gehause / 1/10", clear package 1 = Anode / anode 2 = Kathode / cathode
Empfohlenes Lotpaddesign Recommended Solder Pad Design
Wellenloten TTW TTW Soldering
Anode
4 (0.157)
OHLPY985
Mae in mm (inch) / Dimensions in mm (inch). 2007-03-29 6
4.8 (0.189)
SFH 4350
Lotbedingungen Soldering Conditions Wellenloten (TTW) TTW Soldering
300 C T 250 235 C ... 260 C 2. Welle 2. wave 200 1. Welle 1. wave 150 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling ca 200 K/s 5 K/s 2 K/s
(nach CECC 00802) (acc. to CECC 00802)
OHLY0598
10 s
Normalkurve standard curve Grenzkurven limit curves
0 0 50 100 150 t 200 s 250
Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
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